Tearing Down Sapphire’s RX 9060 XT 16GB & 8GB Pulse GPUs

The video disassembles Sapphire’s RX 9600 XT Pulse GPUs, highlighting differences between the 16GB and 8GB models, including memory placement and thermal pad configurations, while praising their serviceability and straightforward design.
Detailed Summary for Tearing Down Sapphire’s RX 9060 XT 16GB & 8GB Pulse GPUs by Monica

This video focuses on the teardown of Sapphire’s RX 960 XT GPUs, showcasing their thermal performance and internal assembly.

• Introduction to the RX 960 XT and the specific models being analyzed.}
• Discussion of the thermal performance, noting temperatures of the GPU core and memory.}
• Anticipation of a straightforward teardown process due to the simpler design of lower-end models.}
• Promotion of Thermal Grizzly’s Duronaut thermal paste, emphasizing its longevity and performance.}
• Confirmation of the GPU’s overclocking capabilities, meeting the required frequency.}

The video showcases the disassembly process of Sapphire’s RX 9060 XT GPUs, emphasizing the ease of access to components and the serviceability of the design.

• The disassembly process is noted to be one of the easiest the presenter has encountered, indicating a user-friendly design.}
• The GPU features a classic Sapphire design with a reference PCB, suggesting a standard approach to their lower-end models.}
• The cooler assembly allows for easy fan replacement without disturbing the thermal paste, enhancing serviceability.}
• The presenter expresses frustration with the connectors but acknowledges the overall accessibility of the GPU components.}

The video provides a detailed disassembly of the Sapphire RX 9060 XT GPUs, focusing on the assembly process, thermal management, and component layout.

• Introduction to the disassembly process, emphasizing the ease of assembly but noting a need for improvement in fan connector design.}
• Discussion on the GPU’s internal components, including the use of a small die and the implementation of phase change thermal pads for effective heat management.}
• Overview of thermal management features, detailing the placement of thermal pads on key components like MOSFETs and memory modules.}

The video provides a detailed examination of the Sapphire RX 9060 XT GPUs, focusing on the design choices, component layout, and manufacturing insights that characterize the graphics cards.

• Discussion on the potential design improvements for solder joints and additional controller placements.}
• Overview of fan connector options and the implications of using different connector types for performance.}
• Insights into AMD’s new printing technology used on the GPU, highlighting the importance of detailed markings for component identification.}
• Notable mention of the unusual memory placement on the back of the GPU, indicating a shift in design strategy.}

The video focuses on the thermal management and design differences between the 16GB and 8GB models of Sapphire’s RX 9060 XT GPUs, highlighting the importance of cooling for optimal performance.

• Discussion on the effective use of surface area for cooling, noting the memory modules’ relatively low heat.}
• The presenter begins disassembling the 8GB model to check for single-sided memory configurations.}
• Observation of an extra thermal pad on the 8GB model that was absent in the 16GB model, indicating potential differences in thermal management.}
• Noted differences in the back side of the 8GB board, specifically the absence of an additional eight-pin connector.}

The video discusses the design flaws and thermal management issues of Sapphire’s RX 9060 XT graphics cards, focusing on the differences between the 16GB and 8GB models.

• The video highlights a poor design choice that affects the thermal management of the GPU.}
• It notes the absence of a thermal pad on the back of the MOSFETs, which could be a significant oversight.}
• The speaker explains the difference in power connector configurations between the 16GB and 8GB models.}
• The 16GB model has additional memory on the back and different thermal pad arrangements compared to the 8GB model.}
• The video concludes by emphasizing the missing thermal pads in both models, which could impact performance.}